9. RELIABILITY OF THE L-2010 AND THE L-17D |
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The L-2010 logarithmic video circuits are manufactured for ANADYNE, INC. on a proprietary basis by Maxim Integrated Products, Inc. using the CB20 QuickChip 10-40 process. The quality control system used in the manufacture is their commercial flow system. The reliability of these products is very high as can be seen by referring to a reliability study of Maxim’s products which can be found at the following website: http://pdfserv.maxim-ic.com/arpdf/RR-B2A.pdf In order to assure even higher reliability, the design of the L-2010 is extremely conservative. Voltages never exceed 70% of the breakdown voltages specified for the CB20 QuickChip 10-40 process. (For example, while the collector to substrate breakdown for this process is 34V, the maximum used in the L-2010 design is 16V.) Wafers (each of which contains approximately 2,400 L-2010 die) are provided directly to ANADYNE by Maxim after manufacture. Each wafer is numbered and records kept by Maxim which provide traceability. ANADYNE then has the wafer sliced, and the die plated in a manner that allows each die to be assigned a row-column number which indicates its position on the wafer prior to slicing. This task is performed by Hybrid Circuits, Inc., (HCI). HCI then performs a visual inspection of the die per MIL-STD 883, METHOD 2010, CLASS B. L-2010 die are packaged in sealed ceramic packages to become L-17D parts. Each die is bonded by HCI in accordance with HCI drawing 1610, Rev. C, using a Kyocera housing (36CQFP # PB-F86140-B-03) and then capped with a Williams Advanced Materials lid (Part # W269-010/1212-0021). After bonding but prior to capping, a visual inspection per MIL-STD 883, METHOD 2010, CLASS B, is performed. After capping, a Stabilization Bake is performed per MIL- STD 883, METHOD 5004.9, Class B. The following tests are then performed at a MIL-Certified facility in accordance with MIL-STD 883, METHOD 5004.9, CLASS B: 3.1.4 Temperature Cycling; 3.1.5 Constant Acceleration (30,000g test for eutectic die-attached parts); 3.1.16 Seal Fine and Gross Leak Tests; and 3.1.19 External Visual. Finally, ANADYNE performs its own (non-Mil-certified) burn-in of each L-17D part for a minimum of 17 hours at 150º C followed by a 17-hour bake at 150º C. Junction temperatures during the burn-in are approximately 170º C. Each part is then electrically tested (both AC and DC) to ensure that the part is functioning properly, that the package pin bonding is correct, and that the die attachment to the package bottom is thermally adequate. AC testing includes pulse waveform and transfer function checks. |
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37 February 20, 2008 |
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